AI AIKENUO Thermal Pad 12W/mK, 100x100x1.5mm Insulated Heat Resistant High Temperature Resistant Silicone Thermal Pads for Laptop Heatsink/CPU/GPU/SSD/IC/SMD/LED Cooler
Read more Main Features: thermal pad has 12W/mK Thermal Conductivity, High temperature performance in -40 ℃ - 200 ℃ will not melt, Used to fill the gap between the heating element and the Heatsink, Achieve the best cooling effect, thermal pad with good Insulation,Non-conductive, anti- static, wear-resistant, compression, buffering, fire-retardant, anti- corrosion,Non-toxic, odorless, no damage to metal materials, etc effect. Applicable industry: LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV, communications industry, Industrial industry, household electrical appliance industry. Widely application for: 1: Electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high power LED lighting, Car machine. 2: Power devices, automotive electronic modules (engine scrubber) Power modules, high power power supplies. 3: Computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives), laptop and any electronic equipment needing to be filled with heat dissipation. Why use thermal silicone Pad ? 1: The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance, Thermal conductivity of silicone Pad can be good filling the gap between the contact surface; 2: because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface,And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface; 3: with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better full contact, 4: Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference. Package included: 1 100x100x1.5mm Thermal Pad
Product Features
- Good Heat Dissipation: Upgraded thermal silica gel material with 12 W/mK thermal conductivity, our thermal pad greatly improve CPU / GPU/chipset / LED/ ic module and the heat sink Heat transfer between electronic components,and effectively cool the temperature down in seconds.Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, and also serve as insulation, shock absorption and sealing Equal effect.
- Widely Used:Perfectly replaces traditional heatsink compound grease paste, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, 3d printerauto, mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules
- Good Cooling, Insulation, Thermal Conductivity, Wear Resistant, Non Conductive, Antistatic,Fire Retardant, Heat Resistance, High Temperature Resistance, Compression, Buffering, Etc.
- Super Reliable Durable: In -40 C -200 C Range Does Not Melt, Good Stability, No Toxic, Odorless,No Corrosion,No Stimulation,No Damage To Metal Materials.It Can Be Arbitrarily Cut Size,Easy To Install, Replaces Traditional Heatsink Compound Grease Paste.
- Thermal Silicone Pad Has A Thermal Conductivity Of 12 W/mk, Dimension 100x100x1.5mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap,we committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads.
Tags:cocoon
Color - 1.5mm
Size - 100x100x1.5mm