Thermaltake TG-50 High Performance CPU/GPU Heatsink Thermal Compound | 4g | CL-O024-GROSGM-A
Style:TG-50 Designed to lower CPU temperatures effectively, TG-50 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-50’s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O024-GROSGM-ATHERMAL CONDUCTIVITY: 8 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 47 Pa-sTHERMAL IMPEDANCE: 0.035°C -in /WDENSITY: 2.9 g/cm
Product Features
- [High Performance] Contains diamond powder for higher heat transfer providing a thermal conductivity of 8.0 W/m-k.
- [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
- [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
- [Sustainability and Safety] The TG-50 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking.
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